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# PowerDirector tutorials
The basic Photoshop tutorials show you how to use Photoshop in a limited way, but PowerDirector offers so many additional features that you can turn your Photoshop skills into a real workflow. See the videos on PowerDirector’s official website for helpful information on how to master this program.
In addition to tutorials, PowerDirector provides a book, _Creating with Adobe PowerDirector_, that describes the extensive number of video editing features available in the program. The book is written by Robert Gynvaelen, an experienced editor and instructor at Lynda.com, which offers a wide array of free video-editing tutorials.
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Before editing an image in Adobe Photoshop or its Elements equivalent, you have to resize the image if the scene requires a higher resolution. For instance, let’s say you’re editing a portrait of an actor with a scene that has an oblong window. It makes sense to just resize the image to be as big as the window so that it is not cropped on the sides, and then crop it to fit the intended frame size. Photoshop Elements also allows you to resize the image.
To get the most out of both applications, you need to have a good understanding of the editing functions. In this post, we show how to resize and crop an image in Photoshop and in Photoshop Elements.
How to Resize an Image in Photoshop and in Photoshop Elements
Open the image that you want to resize in Photoshop or Photoshop Elements.
Locate the pane in the menu bar that says Object. You can do that by right-clicking anywhere in the image and selecting the Size & Crop (Figure A) or Crop (Figure B) command.
On the menu bar, click Cropping (Figure A) or Resizing (Figure B).
This is the panel where you can choose all of the options for resizing and cropping.
To resize an image in Photoshop and in Photoshop Elements, follow these steps:
Click the Width menu item and choose Custom. Then, change the value. This determines how many pixels the image will be.
The Width of an image is determined by the height (in pixels) and the current width (in pixels) of the image. An image is 200 pixels by 300 pixels. If you change the Width to 600 pixels, the image becomes 50 percent wider. If you add 300 pixels to the current Width, it means that the image is now 100 percent wider.
Click the Height menu item and choose Custom. Then, change the value. This determines how many pixels the image will be.
The Height of an image is determined by the height (in pixels) and the current height (in pixels) of the image. An image is 200 pixels by 300 pixels. If you change the Height to 600 pixels, the image becomes 50 percent taller. If you add 300 pixels to the current Height, it means that the image is now 100 percent taller.
Click Apply. The new size will be applied.
If you don’t see the Apply button, click the Resize or Crop button. When
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The aim of this study was to systematically review the literature with regard to the relationship between body mass index (BMI) and the success of laparoscopic surgery. A literature search of Medline, Embase, and the Cochrane Library through December 2011 was performed. Studies were eligible if they reported on a laparoscopic surgical procedure in adult patients that investigated the influence of BMI on success or failure rates. Of the 3,281 articles identified, 24 were included. Ten articles reported on laparoscopic cholecystectomy, nine on laparoscopic colectomy, three on laparoscopic appendectomy, and two on laparoscopic gastrectomy. The results showed a significant relationship between increasing BMI and failure rates. Patients with a BMI or =30 kg/m(2)) had a significant increase in the risk of failure. The risk of conversion was increased in overweight patients (> or =25-29.9 kg/m(2)) and obese patients (> or =30 kg/m(2)). Surgical duration was prolonged in obese patients (> or =30 kg/m(2)). The results of this review indicate that patients with a BMI or =25-29.9 kg/m(2)) should be considered as possible candidates for laparoscopic surgery, but it is currently unclear whether obesity is associated with an increased risk of failure. Further large-scale studies are needed to clarify the relationship between BMI and success or failure rates of laparoscopic surgery.Karolina ska bli 18, men det är för tidigt att påbörja studierna. Sedan hon var nio år har hon jobbat som parkvisningsenhetsbiträde.
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The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly to a method of forming a pad in a microminiature semiconductor device.
With an increase of the integration degree in a semiconductor device, an interval of wiring layers becomes smaller. Therefore, when an inter-layer insulating film is formed in a pad region in which contact holes are to be formed after forming wiring layers and an inter-layer insulating film in a semiconductor device, the open area of contact holes formed on the inter-layer insulating film decreases due to the formation of the wiring layers. Therefore, a voltage generated at a wiring layer, particularly, wiring layers in close vicinity of a contact hole becomes greatly different from that of an ordinary voltage, so that there is a possibility of causing a trouble in the operation of the semiconductor device or of the semiconductor device itself.
FIGS. 1(a) to 1(e) illustrate a method of manufacturing a conventional semiconductor device.
Referring to FIG. 1(a), contact holes 3 are formed in an inter-layer insulating film 2 on a silicon substrate 1, and a wiring layer 5 is formed on the inter-layer insulating film 2 including the contact holes 3. Then, the pad region to which a bump is to be formed is defined by a resist pattern (not shown).
Referring to FIG. 1(b), a photoresist layer is formed on the wiring layer 5, and a photolithography step is performed thereon to form a photoresist pattern 6. An etching step is performed on the silicon substrate 1 and the wiring layer 5 by the use of the photoresist pattern 6 as a mask to form a pad pad portion 7 on the silicon substrate 1 and the wiring layer 5.
Referring to FIG. 1(c), the photoresist pattern 6 is removed. Referring to FIG. 1(d), a barrier metal layer 8 is formed on the silicon substrate 1, the pad pad portion 7, and the wiring layer 5, and a bump 9 is formed by the use of the barrier metal layer 8 as a mask. Thereafter, the barrier metal layer 8 and the wiring layer 5 are etched so that the bump 9 is formed only in the pad region of the wiring layer 5. Thus, the pad is formed.
However, in the conventional semiconductor device, the open area of the contact hole on the inter-layer insulating film in the pad
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